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Planibond Hi-Mod Gel LPL

Long-Pot-Life, High-Modulus, Nonsag, Structural Epoxy Adhesive

Planibond® Hi-Mod Gel LPL is a high-modulus, high-strength, moisture-tolerant, zero-VOC, two-part, nonsag, structural epoxy adhesive designed for a wide variety of bonding and repair applications, while providing a long pot life and open time.

  • 2:1 mixing ratio
  • 100%-solids, solvent-free product with zero VOC content
  • Nonsag, high-modulus and high-strength
  • Moisture-tolerant
  • Long pot life
  • May be extended with graded sands
  • Cures to a light gray color that is similar to concrete color
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Description

Product documentation

Construction and Restoration Systems

Technical Data Sheet

Safety Data Sheet

Specifications

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